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| CYStech Electronics Corp. Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 1/8 Dual N-Channel Logic Level Enhancement Mode Power MOSFET MTB45A06Q8 Description BVDSS 60V ID 6A RDSON(MAX.) 45m The MTB45A06Q8 provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features * RDS(ON)=45m@VGS=10V, ID=6A * Simple drive requirement * Low on-resistance * Fast switching speed * Dual N-ch MOSFET package * Pb-free and Halogen-free package Equivalent Circuit MTB45A06Q8 Outline SOP-8 GGate SSource DDrain MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25C) Parameter Symbol Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 2/8 Limits Unit Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TC=25C Continuous Drain Current @ TC=100C Pulsed Drain Current Avalanche Current Avalanche Energy @ L=0.1mH, ID=6A, RG=25 Repetitive Avalanche Energy @ L=0.05mH TA=25 Total Power Dissipation TA=100 Operating Junction and Storage Temperature Range VDS VGS ID IDM IAS EAS EAR PD Tj, Tstg 60 20 6 4.5 24 *1 15 7.2 3.6 *2 2.4 1.3 -55~+175 V A mJ W C 100% UIS testing in condition of VD=30V, L=0.1mH, VG=10V, IL=10A, Rated VDS=60V N-CH Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Value 25 62.5 *3 Unit C/W C/W Note : 1. Pulse width limited by maximum junction temperature 2. Duty cycle1% 3. Surface mounted on 1 in copper pad of FR-4 board, 125C/W when mounted on minimum copper pad Characteristics (TC=25C, unless otherwise specified) Symbol Static BVDSS VGS(th) GFS IGSS IDSS ID(ON) RDS(ON) Dynamic Ciss Coss Crss *1 *1 Min. 60 1.0 5 - Typ. 2.0 15 40 55 1213 86 70 Max. 3.2 100 1 25 45 70 - Unit V V S nA A A m m Test Conditions VGS=0, ID=250A VDS = VGS, ID=250A VDS =5V, ID=5A VGS=20 VDS =48V, VGS =0 VDS =40V, VGS =0, Tj=125C VDS =5V, VGS =10V VGS =10V, ID=6A VGS =5V, ID=5A *1 pF VGS=0V, VDS=30V, f=1MHz MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. Characteristics (TC=25C, unless otherwise specified) Symbol Qg *1, 2 Qgs *1, 2 Qgd *1, 2 td(ON) *1, 2 tr *1, 2 td(OFF) *1, 2 tf *1, 2 Source-Drain Diode IS *1 ISM *3 VSD *1 Min. Typ. 12 2.5 2.6 12 8 20 7 Max. 2.3 9.2 1.2 Unit nC Test Conditions Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 3/8 VDS=30V, VGS=10V, ID=5A VDS=30V, ID=1A, VGS=10V, RGS=6 ns A V IF=IS, VGS=0V Note : *1.Pulse Test : Pulse Width 300s, Duty Cycle2% *2.Independent of operating temperature *3.Pulse width limited by maximum junction temperature. Ordering Information Device MTB45A06Q8 Package SOP-8 (Pb-free & Halogen-free package) Shipping 2500 pcs / Tape & Reel Marking B45A06 MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 4/8 MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves(Cont.) Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 5/8 MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 6/8 Carrier Tape Dimension MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 7/8 Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat -Temperature Min(TS min) -Temperature Max(TS max) -Time(ts min to ts max) Time maintained above: -Temperature (TL) - Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds 240 +0/-5 C 10-30 seconds 6C/second max. 6 minutes max. Pb-free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260 +0/-5 C 20-40 seconds 6C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTB45A06Q8 CYStek Product Specification CYStech Electronics Corp. SOP-8 Dimension Top View A Right side View G Spec. No. : C713Q8 Issued Date : 2009.06.02 Revised Date : Page No. : 8/8 Marking: I B C H Device Name J D Front View Part A Date Code E Part A K L N O 8-Lead SOP-8 Plastic Package CYStek Package Code: Q8 M F *: Typical DIM A B C D E F G H Inches Min. Max. 0.1909 0.2007 0.1515 0.1555 0.2283 0.2441 0.0480 0.0519 0.0145 0.0185 0.1472 0.1527 0.0570 0.0649 0.1889 0.2007 Millimeters Min. Max. 4.85 5.10 3.85 3.95 5.80 6.20 1.22 1.32 0.37 0.47 3.74 3.88 1.45 1.65 4.80 5.10 DIM I J K L M N O Inches Min. Max. 0.0019 0.0078 0.0118 0.0275 0.0074 0.0098 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059 Millimeters Min. Max. 0.05 0.20 0.30 0.70 0.19 0.25 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: pure tin plated * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTB45A06Q8 CYStek Product Specification |
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